Startup des Monats Mai 2026: Bond-IQ GmbH

Kurzbeschreibung:

Bond-IQ GmbH makes wire bonding processes even safer, more efficient, and more successful. As a specialized partner for wire bonding training, consulting, and process optimization, we help companies in manufacturing and development solve technical challenges in a targeted manner and elevate their processes to a new level of performance. From failure analysis and application testing to prototyping, seminars, and in-house training, we offer practical support that directly benefits quality, productivity, and knowledge development. Our multi-client projects also facilitate valuable knowledge transfer and provide new momentum for the industry.

 

Produktspektrum/Dienstleistungsangebot:

  • process setup wire bonding
  • failure analysis and technical consulting
  • application testing and prototyping
  • hands-on seminars, in-house training
  • machine training at our lab or in-house
  • individual user support 

Branchen:

  • Packaging technologies, focus wire bonding
  • Automotive, Medical, Industrial
  • Small, medium and large size companies

Neuheiten/Innovationen/derzeitige Aktivitäten:

We have expanded our offerings to include new, tailored training formats: from open seminars with multiple participants to customized in-house training and online training, as well as user calls designed to provide targeted assistance to process specialists. This ensures that every company can find the format that best suits its needs.

Through the multi-client project surfguide, we are driving forward the specification of bonding surfaces together with more than 70 partners. The focus is on key topics such as cleanliness, roughness, coating structure, storage, and cleaning, as well as other quality-relevant factors. In 2026, the milestone of 70 partner companies was reached; new partners can join the project at any time and benefit from this strong industry network (https://www.bond-iq.com/surfguide).

Webseite: www.bond-iq.de / www.bond-iq.com 

Ansprechpartner: Stefan Schmitz, stefan.schmitz@bond-iq.de

 

Frequently requested links

ConfTool ECCE Europe 2024 (registration, programme) 

Social Events

Sponsorship & Exhibition Opportunity 2025  join ECCE Europe 2025 in Birmingham!

 

ECCE Europe 2024 is organized by

in cooperation with Local Organization (PCO)

Kenzler Conference Management (KCM)
Karla-Schmidt-Str. 14
30655 Hannover, Germany


Tel: +49 (0)511 65581860
E‐Mail:  info[at]ecce-europe[dot]org 
Website: https://kcmweb.de

 

Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0

© 2024 ECPE European Center for Power Electronics e.V.