Semiconductor Packaging University Program

The Fifth Edition of the CITC Semiconductor Packaging Course starting soon!

Semiconductor Packaging University Program for Industry Participants

The program provides a connection between education and industry and as such contributes to the training and skills of people that align with industry needs. People who are in high demand – now and in the future. The program therefore represents an important step in securing the future of the semiconductor industry in Europe.

CITC Brochure

CITC Website

 

ECCE Europe 2025 is organized by

in cooperation with Local Organization (PCO)

Kenzler Conference Management (KCM)
Karla-Schmidt-Str. 14
30655 Hannover, Germany


Tel: +49 (0)511 65581860
E‐Mail:  info[at]ecce-europe[dot]org 
Website: https://kcmweb.de

 

Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0

© 2024 ECPE European Center for Power Electronics e.V.