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Title

Chair and Speakers

Data Center Power Systems 
Location: tbd

The rapid deployment of AI infrastructure is fundamentally reshaping data center power systems. The unprecedented growth in computing density and power demand is driving major changes in power architectures from the power grid down to chip-level power delivery. These developments introduce new technical challenges in system stability, power quality, protection, and grid interconnection that require coordinated advances across power electronics, power systems, and data center engineering. 

This industry forum brings together leading experts from hyperscale cloud providers, data center operators, equipment manufacturers, transmission system operators, and research institutions to provide a comprehensive perspective on the future of data center power systems. The session begins with an overview of the evolution of AI computing infrastructure and its implications for power system design. It then examines stability challenges associated with gigawatt-scale AI training campuses, followed by utility perspectives on technical requirements for grid connection of large data centers. The session further introduces emerging methodologies for stability analysis of hybrid AC-DC architectures, discusses enabling technologies for DC power distribution, and concludes with experimental validation and testing of DC technologies for next-generation data centers. 

The presenters represent organizations at the forefront of AI infrastructure and power system innovation. Collectively, they bring expertise spanning hyperscale data center design and operation, transmission planning, power electronics, grid integration, DC distribution, and system stability. Their combined experience in industrial deployment, standards development, utility operations, and academic research provides attendees with a unique opportunity to learn about both the practical challenges and emerging technologies shaping future data center power systems. 

Jian Sun (Chair) 
Professor at Rensselaer Polytechnic Institute, USA 

Frank Schafmeister  
DELTA Energy Systems, Germany

Mauricio Cespedes 
Meta, USA 

Ehsan Nasr 
Lead Scientist and Director of Energy Technology within Microsoft's Data Center Advanced Development Team 

Pavel Purgat 
Global LVDC Distribution Architect at ABB, Austria 

Soenke Rogalla 
Fraunhofer Institute for Solar Energy Systems, Germany 

Daniel Stenzel 
TenneT TSO GmbH, Germany 


Grid-Forming Loads: Shifting Stability and Flexibility to the Demand Side 
Location: tbd 

Modern power systems are currently facing the challenge of integrating large shares of variable, non-dispatchable Renewable Energy Sources (RES) such as solar PV and wind power. In contrast to conventional systems based on dispatchable fossil-fuel plants, high-RES grids must deal with variability while keeping reliability and stability within acceptable limits. This requires for advanced control strategies, energy storage solutions, and increased demand-side flexibility to ensure proper system operation. However, the growing presence of power-interfacing converters not only introduces new operational challenges, but also enables new concepts and possibilities, such as Grid-Forming Loads (GFM-L).  

GFM-Ls go beyond the traditional passive role of loads by combining demand balancing with active grid formation through voltage stiffness and synchronization power provided by the loads themselves. By transferring part of the flexibility and stability support to the demand side, it becomes possible to reduce the dependence on generation controllability and allow RES to operate continuously at their Maximum Power Point (MPP), thus minimizing curtailment. In addition to the technical contribution, GFM-Ls open the door to market-driven innovations, enabling new ancillary service products, enhanced demand participation, and value-stacking opportunities for industrial stakeholders. Nevertheless, large-scale implementation requires scalable control architectures, interoperable standards, and viable business models consistent with evolving electricity market frameworks.  

The concept is applicable to isolated systems, weak grids, and future renewable-dominated networks, where potentially millions of coordinated loads could contribute to system stability while maximizing renewable integration. In this sense, GFM-L represent not only a shift in grid operation, but also an opportunity for industrial competitiveness and effective technology transfer.  

This special session will introduce the GFM-L concept, explored by the organisers and some contributors in the Horizon Europe project GridForLoads. Besides, the session will also gather other experts from industry and academia to discuss implementation strategies, system-level impacts, and deployment challenges, followed by an open discussion with the audience.

Oriol Gomis Bellmunt (Chair) 
Professor, Universitat Politècnica de Catalunya  

Joan Marc Rodriguez Bernuz (Chair) 
Researcher, CITCEA-Universitat Politècnica de Catalunya  

Jaume Girona-Badia 
Senior Engineer, Universitat Politècnica de Catalunya  

Pol Olivella Rosell 
Product Manager, Wallbox Chargers 

Macarena Martin Almenta  
Power System Reliability Engineer. Red Electrica 

Saman Dadjo Tavakoli  
Principal control engineer at Siemens Energy, Germany 

Adolfo Anta  
Senior researcher, Austrian Institute of Technology 

Florent Morel  
Coordinator of Research activities and participation in collaborative projects, SuperGrid Institute. 

Ying Pang  
Research Engineer in SuperGrid Institute 


Sustainable Power Electronics Design: Devices to Systems 
Location: tbc

Power electronics is undergoing a paradigm shift in which sustainability, environmental compatibility, and life‑cycle impact are becoming central design objectives rather than secondary considerations. This session brings together perspectives ranging from power semiconductor technologies and converter design methodologies to system‑level life‑cycle assessment (LCA) and sustainable R&D practices. 

The invited talks explore how next‑generation power electronics can address environmental challenges through advances in wide bandgap devices, efficient and compact converter architectures, material and manufacturing considerations, and life‑cycle‑aware design frameworks. Emphasis is placed on integrating sustainability considerations such as efficiency, reliability, material usage, and end of life impact early in the research and design process. 

Together, these contributions highlight how sustainability is shaping the future of power electronics across research, industrial development, and real‑world deployment. 

Shiori Idaka (Chair) 
Head of European Research Cooperation Centre, Mitsubishi Electric Europe B.V. 

Jonas Huber 
Assistant Professor (Tenure-Track), ETH Zürich, Power Electronics and Drive Systems 

Laura VAUCHE 
Sustainability & LCA Engineer, CEA-Leti, Silicon Devices Division (DCOS) 

Lorenzo Giuntini 
Principal Engineer, ABB Switzerland Ltd 


Design Automation and AI for Industrial Power Electronics 
Location: tbd

Artificial intelligence and design automation are moving from exploratory research topics to practical enablers in industrial power electronics engineering. In line with the scope of IEEE PELS TC10, which focuses on design automation, AI and machine learning, advanced optimization, and the broader methodological transformation of converter design, this Industry Forum session will examine how these methods are being adopted in real industrial workflows for power electronics applications.  

The session will bring together contributors from the automotive industry, applied research, and engineering software to discuss where AI-based and automated design tools already create value, where they still fail, and what is required for broader industrial deployment. Topics will include accelerated converter and component design, simulation-driven optimisation, data-enabled engineering workflows, surrogate modelling, and the integration of AI tools into existing industrial development chains. The discussion will also address practical barriers, including model reliability, data quality, interoperability with established tools, engineering trust, and qualification for safety-critical applications. 

Rather than presenting AI as a replacement for engineering expertise, the session will focus on realistic pathways to augment industrial power-electronics design. The objective is to provide ECCE Europe attendees with a clear picture of current industrial needs, transferable lessons from early adoption, and concrete challenges that should shape future research and tool development. 

 

 

Wilmar Martinez Martinez (Chair) 
KU Leuven  

Kevin Hermanns 
PE Systems 

Andreas Rosskopf 
Fraunhofer IISB 

Kaushik Mirdoddi 
Silicon Austria Labs 

Roberto Petrella   
Silicon Austria Labs 


GaN Integration for Europe
Location: tba

Affordable smart GaN IC solutions for greener applications is a 3,5 years Chips Joint Undertaking and its member funded project, which started in 04/2023 and will end in 10/2026. The panel at the industry forum aims to present the project providing a consolidate view on the project achievement, linking device – model innovation with practical use-cases. Contributions from Infineon and imec will highlight the newest power devices, starting from the world-class performance 200mm/8-inch wafers to the 100 V GaN ICs and introducing the newly released monolithic bi-directional switch as well.

The panel will also showcase the industrial and application-level results, with experience from the Projects’ Use Cases in the sector of transport and mobility. Particularly, AME will present its development on the a10kW bi-directional DC EV-charger module using 650V GaN switches. By utilizing high-switching-frequency GaN devices, system-on-board solution, and advanced control scheme, a power converter, highlighted by high efficiency, lower volume, low audible noise, and better manufacturability, is realized. Moreover, IKERLAN will present a wireless charging solution for electric vehicles based on inductive power transfer (IPT) technology and GaN integrated circuits. GaN enables higher switching frequencies, lower losses, and more compact magnetic and thermal designs, making it especially attractive for high-density, high-efficiency systems such as automated charging for future autonomous EVs. FRONIUS will present a single-phase hybrid PV-Inverter with GaN in the bidirectional DC/DC battery stage. Most of the annual operating time the battery stage works with less than 10 percent of the nominal power 365 days a year for ten hours during night. Therefore GaN-power transistors are best suited semiconductor technology for light-load conditions. UPM will discuss about the main challenges that we need to resolve in order to design high power density converters. They will cover the issues of electro-thermal modelling, thermal management and digital twinning, as a tool that could help us in the future.

With a future oriented perspective, the AAU developed roadmap of GaN power devices and the design of an on-state voltage measurement circuit for GaN devices will be the occasion of discussion industrial challenges, market opportunities and new technologies adoption paths.

Miroslav VASIĆ (Chair)
Full Professor, Universidad Politecnica de Madrid (UPM)

Ander AVILA  (Co-chair)
Senior Researcher and Project Manager in the Power Electronics area, IKERLAN Technology Research Centre

Karen GEENS 
Team Leader GaN Power Integration, Interuniversity Electronics Center (imec)

Kennith KIN LEONG
Lead Principal, Product Definition and Concept Engineer for CoolGaN™ BDS., Infineon Technologies Austria AG

Lie WANG 
Power Electronics Engineer, Applied Micro Electronics (AME)

Seny DU 
Postdoctoral Researcher , AAU Energy, Aalborg University

Günter RITZBERGER
Team- and Project Leader in the Research department, FRONIUS International GmbH

Jan SCHELLEKENS 
Technical Specialist Power conversion, Applied Micro Electronics (AME)

Victor VELIADIS
Chair of International Roadmap for Wide Bandgap Power Semiconductors (ITRW), Power America and North Carolina State University, USA

 


From Grid Disturbances to More Resilient Converter-Based Transmission Systems
Location: tba

This session will present the upcoming trends and enabling technologies for the next generation of power electronics within X-in-1 integration concepts, with particular emphasis on the transition of onboard chargers from two-stage to single-stage topologies. As electrified powertrains continue to evolve toward higher integration, improved efficiency, and reduced system complexity, these developments are becoming increasingly relevant for future mobility platforms.

The session will offer complementary perspectives on the introduction of these technologies across the supply chain, ranging from system-level suppliers to component-level innovations. It will highlight key technology trends in passive components, magnetics, and novel raw materials, as well as semiconductor advancements such as the GaN-based bidirectional switch (BDS). Furthermore, the session will address the challenges and opportunities associated with the validation of these emerging technologies, including their final assessment in power HIL test benches.

Overall, the session aims to provide a comprehensive view of the technological building blocks that will shape the next generation of compact, efficient, and highly integrated power electronic systems.

Milan PRODANOVIC (Chair)
Head of Electrical Systems Unit Instituto IMDEA Energía

Javier RENEDO
Department of Power System Reliability, Red Eléctrica - Redeia, 

Irma VILLAR
Team Leader, Electromagnetism and Converters Contro, IKERLAN


Addressing the next challenges in application of power electronics for automotive application
Location: tba

This session will present the upcoming trends and enabling technologies for the next generation of power electronics within X-in-1 integration concepts, with particular emphasis on the transition of onboard chargers from two-stage to single-stage topologies. As electrified powertrains continue to evolve toward higher integration, improved efficiency, and reduced system complexity, these developments are becoming increasingly relevant for future mobility platforms.

The session will offer complementary perspectives on the introduction of these technologies across the supply chain, ranging from system-level suppliers to component-level innovations. It will highlight key technology trends in passive components, magnetics, and novel raw materials, as well as semiconductor advancements such as the GaN-based bidirectional switch (BDS). Furthermore, the session will address the challenges and opportunities associated with the validation of these emerging technologies, including their final assessment in power HIL test benches.

Overall, the session aims to provide a comprehensive view of the technological building blocks that will shape the next generation of compact, efficient, and highly integrated power electronic systems.

 

Juan Alberto Romero Baena (Chair)
Innovation Battery & Charging Technology, VT E I SVE, Schaeffler

Felix Neizert
Product Marketing Manager, Infineon Technologies

Bharadwaj Reddy Andapally
Technical Market Development Specialist and Technical Advisor for Nanocrystalline Soft Magnetic Materials, CBMM 

Samir Ajlaoui
Research and Developing Engineer (R&D), TDK Electronics AG

Dragan Zuber
Senior Sales and Business Developer, Academia, TyphoonHIL

 

ECCE Europe 2026 is organized by

in cooperation with Local Organization (PCO)

Kenzler Conference Management (KCM)
Karla-Schmidt-Str. 14
30655 Hannover, Germany


Tel: +49 (0)511 65581860
E‐Mail:  info[at]ecce-europe[dot]org 
Website: https://kcmweb.de

 

Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0