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Data Center Power Systems
Location: tbd
The rapid deployment of AI infrastructure is fundamentally reshaping data center power systems. The unprecedented growth in computing density and power demand is driving major changes in power architectures from the power grid down to chip-level power delivery. These developments introduce new technical challenges in system stability, power quality, protection, and grid interconnection that require coordinated advances across power electronics, power systems, and data center engineering.
This industry forum brings together leading experts from hyperscale cloud providers, data center operators, equipment manufacturers, transmission system operators, and research institutions to provide a comprehensive perspective on the future of data center power systems. The session begins with an overview of the evolution of AI computing infrastructure and its implications for power system design. It then examines stability challenges associated with gigawatt-scale AI training campuses, followed by utility perspectives on technical requirements for grid connection of large data centers. The session further introduces emerging methodologies for stability analysis of hybrid AC-DC architectures, discusses enabling technologies for DC power distribution, and concludes with experimental validation and testing of DC technologies for next-generation data centers.
The presenters represent organizations at the forefront of AI infrastructure and power system innovation. Collectively, they bring expertise spanning hyperscale data center design and operation, transmission planning, power electronics, grid integration, DC distribution, and system stability. Their combined experience in industrial deployment, standards development, utility operations, and academic research provides attendees with a unique opportunity to learn about both the practical challenges and emerging technologies shaping future data center power systems.
Jian Sun (Chair)
Professor at Rensselaer Polytechnic Institute, USA
Frank Schafmeister
DELTA Energy Systems, Germany
Mauricio Cespedes
Meta, USA
Ehsan Nasr
Lead Scientist and Director of Energy Technology within Microsoft's Data Center Advanced Development Team
Pavel Purgat
Global LVDC Distribution Architect at ABB, Austria
Soenke Rogalla
Fraunhofer Institute for Solar Energy Systems, Germany
Daniel Stenzel
TenneT TSO GmbH, Germany
Grid-Forming Loads: Shifting Stability and Flexibility to the Demand Side
Location: tbd
Modern power systems are currently facing the challenge of integrating large shares of variable, non-dispatchable Renewable Energy Sources (RES) such as solar PV and wind power. In contrast to conventional systems based on dispatchable fossil-fuel plants, high-RES grids must deal with variability while keeping reliability and stability within acceptable limits. This requires for advanced control strategies, energy storage solutions, and increased demand-side flexibility to ensure proper system operation. However, the growing presence of power-interfacing converters not only introduces new operational challenges, but also enables new concepts and possibilities, such as Grid-Forming Loads (GFM-L).
GFM-Ls go beyond the traditional passive role of loads by combining demand balancing with active grid formation through voltage stiffness and synchronization power provided by the loads themselves. By transferring part of the flexibility and stability support to the demand side, it becomes possible to reduce the dependence on generation controllability and allow RES to operate continuously at their Maximum Power Point (MPP), thus minimizing curtailment. In addition to the technical contribution, GFM-Ls open the door to market-driven innovations, enabling new ancillary service products, enhanced demand participation, and value-stacking opportunities for industrial stakeholders. Nevertheless, large-scale implementation requires scalable control architectures, interoperable standards, and viable business models consistent with evolving electricity market frameworks.
The concept is applicable to isolated systems, weak grids, and future renewable-dominated networks, where potentially millions of coordinated loads could contribute to system stability while maximizing renewable integration. In this sense, GFM-L represent not only a shift in grid operation, but also an opportunity for industrial competitiveness and effective technology transfer.
This special session will introduce the GFM-L concept, explored by the organisers and some contributors in the Horizon Europe project GridForLoads. Besides, the session will also gather other experts from industry and academia to discuss implementation strategies, system-level impacts, and deployment challenges, followed by an open discussion with the audience.
Oriol Gomis Bellmunt (Chair)
Professor, Universitat Politècnica de Catalunya
Joan Marc Rodriguez Bernuz (Chair)
Researcher, CITCEA-Universitat Politècnica de Catalunya
Jaume Girona-Badia
Senior Engineer, Universitat Politècnica de Catalunya
Pol Olivella Rosell
Product Manager, Wallbox Chargers
Macarena Martin Almenta
Power System Reliability Engineer. Red Electrica
Saman Dadjo Tavakoli
Principal control engineer at Siemens Energy, Germany
Adolfo Anta
Senior researcher, Austrian Institute of Technology
Florent Morel
Coordinator of Research activities and participation in collaborative projects, SuperGrid Institute.
Ying Pang
Research Engineer in SuperGrid Institute
Sustainable Power Electronics Design: Devices to Systems
Location: tbc
Power electronics is undergoing a paradigm shift in which sustainability, environmental compatibility, and life‑cycle impact are becoming central design objectives rather than secondary considerations. This session brings together perspectives ranging from power semiconductor technologies and converter design methodologies to system‑level life‑cycle assessment (LCA) and sustainable R&D practices.
The invited talks explore how next‑generation power electronics can address environmental challenges through advances in wide bandgap devices, efficient and compact converter architectures, material and manufacturing considerations, and life‑cycle‑aware design frameworks. Emphasis is placed on integrating sustainability considerations such as efficiency, reliability, material usage, and end of life impact early in the research and design process.
Together, these contributions highlight how sustainability is shaping the future of power electronics across research, industrial development, and real‑world deployment.
Shiori Idaka (Chair)
Head of European Research Cooperation Centre, Mitsubishi Electric Europe B.V.
Jonas Huber
Assistant Professor (Tenure-Track), ETH Zürich, Power Electronics and Drive Systems
Laura VAUCHE
Sustainability & LCA Engineer, CEA-Leti, Silicon Devices Division (DCOS)
Lorenzo Giuntini
Principal Engineer, ABB Switzerland Ltd
Design Automation and AI for Industrial Power Electronics
Location: tbd
Artificial intelligence and design automation are moving from exploratory research topics to practical enablers in industrial power electronics engineering. In line with the scope of IEEE PELS TC10, which focuses on design automation, AI and machine learning, advanced optimization, and the broader methodological transformation of converter design, this Industry Forum session will examine how these methods are being adopted in real industrial workflows for power electronics applications.
The session will bring together contributors from the automotive industry, applied research, and engineering software to discuss where AI-based and automated design tools already create value, where they still fail, and what is required for broader industrial deployment. Topics will include accelerated converter and component design, simulation-driven optimisation, data-enabled engineering workflows, surrogate modelling, and the integration of AI tools into existing industrial development chains. The discussion will also address practical barriers, including model reliability, data quality, interoperability with established tools, engineering trust, and qualification for safety-critical applications.
Rather than presenting AI as a replacement for engineering expertise, the session will focus on realistic pathways to augment industrial power-electronics design. The objective is to provide ECCE Europe attendees with a clear picture of current industrial needs, transferable lessons from early adoption, and concrete challenges that should shape future research and tool development.
Wilmar Martinez Martinez (Chair)
KU Leuven
Kevin Hermanns
PE Systems
Andreas Rosskopf
Fraunhofer IISB
Kaushik Mirdoddi
Silicon Austria Labs
Roberto Petrella
Silicon Austria Labs
GaN Integration for Europe
Location: tba
Affordable smart GaN IC solutions for greener applications is a 3,5 years Chips Joint Undertaking and its member funded project, which started in 04/2023 and will end in 10/2026. The panel at the industry forum aims to present the project providing a consolidate view on the project achievement, linking device – model innovation with practical use-cases. Contributions from Infineon and imec will highlight the newest power devices, starting from the world-class performance 200mm/8-inch wafers to the 100 V GaN ICs and introducing the newly released monolithic bi-directional switch as well.
The panel will also showcase the industrial and application-level results, with experience from the Projects’ Use Cases in the sector of transport and mobility. Particularly, AME will present its development on the a10kW bi-directional DC EV-charger module using 650V GaN switches. By utilizing high-switching-frequency GaN devices, system-on-board solution, and advanced control scheme, a power converter, highlighted by high efficiency, lower volume, low audible noise, and better manufacturability, is realized. Moreover, IKERLAN will present a wireless charging solution for electric vehicles based on inductive power transfer (IPT) technology and GaN integrated circuits. GaN enables higher switching frequencies, lower losses, and more compact magnetic and thermal designs, making it especially attractive for high-density, high-efficiency systems such as automated charging for future autonomous EVs. FRONIUS will present a single-phase hybrid PV-Inverter with GaN in the bidirectional DC/DC battery stage. Most of the annual operating time the battery stage works with less than 10 percent of the nominal power 365 days a year for ten hours during night. Therefore GaN-power transistors are best suited semiconductor technology for light-load conditions. UPM will discuss about the main challenges that we need to resolve in order to design high power density converters. They will cover the issues of electro-thermal modelling, thermal management and digital twinning, as a tool that could help us in the future.
With a future oriented perspective, the AAU developed roadmap of GaN power devices and the design of an on-state voltage measurement circuit for GaN devices will be the occasion of discussion industrial challenges, market opportunities and new technologies adoption paths.
Miroslav VASIĆ (Chair)
Full Professor, Universidad Politecnica de Madrid (UPM)
Ander AVILA (Co-chair)
Senior Researcher and Project Manager in the Power Electronics area, IKERLAN Technology Research Centre
Karen GEENS
Team Leader GaN Power Integration, Interuniversity Electronics Center (imec)
Kennith KIN LEONG
Lead Principal, Product Definition and Concept Engineer for CoolGaN™ BDS., Infineon Technologies Austria AG
Lie WANG
Power Electronics Engineer, Applied Micro Electronics (AME)
Seny DU
Postdoctoral Researcher , AAU Energy, Aalborg University
Günter RITZBERGER
Team- and Project Leader in the Research department, FRONIUS International GmbH
Jan SCHELLEKENS
Technical Specialist Power conversion, Applied Micro Electronics (AME)
Victor VELIADIS
Chair of International Roadmap for Wide Bandgap Power Semiconductors (ITRW), Power America and North Carolina State University, USA
From Grid Disturbances to More Resilient Converter-Based Transmission Systems
Location: tba
This session will present the upcoming trends and enabling technologies for the next generation of power electronics within X-in-1 integration concepts, with particular emphasis on the transition of onboard chargers from two-stage to single-stage topologies. As electrified powertrains continue to evolve toward higher integration, improved efficiency, and reduced system complexity, these developments are becoming increasingly relevant for future mobility platforms.
The session will offer complementary perspectives on the introduction of these technologies across the supply chain, ranging from system-level suppliers to component-level innovations. It will highlight key technology trends in passive components, magnetics, and novel raw materials, as well as semiconductor advancements such as the GaN-based bidirectional switch (BDS). Furthermore, the session will address the challenges and opportunities associated with the validation of these emerging technologies, including their final assessment in power HIL test benches.
Overall, the session aims to provide a comprehensive view of the technological building blocks that will shape the next generation of compact, efficient, and highly integrated power electronic systems.
Milan PRODANOVIC (Chair)
Head of Electrical Systems Unit Instituto IMDEA Energía
Javier RENEDO
Department of Power System Reliability, Red Eléctrica - Redeia,
Irma VILLAR
Team Leader, Electromagnetism and Converters Contro, IKERLAN
Addressing the next challenges in application of power electronics for automotive application
Location: tba
This session will present the upcoming trends and enabling technologies for the next generation of power electronics within X-in-1 integration concepts, with particular emphasis on the transition of onboard chargers from two-stage to single-stage topologies. As electrified powertrains continue to evolve toward higher integration, improved efficiency, and reduced system complexity, these developments are becoming increasingly relevant for future mobility platforms.
The session will offer complementary perspectives on the introduction of these technologies across the supply chain, ranging from system-level suppliers to component-level innovations. It will highlight key technology trends in passive components, magnetics, and novel raw materials, as well as semiconductor advancements such as the GaN-based bidirectional switch (BDS). Furthermore, the session will address the challenges and opportunities associated with the validation of these emerging technologies, including their final assessment in power HIL test benches.
Overall, the session aims to provide a comprehensive view of the technological building blocks that will shape the next generation of compact, efficient, and highly integrated power electronic systems.
Juan Alberto Romero Baena (Chair)
Innovation Battery & Charging Technology, VT E I SVE, Schaeffler
Felix Neizert
Product Marketing Manager, Infineon Technologies
Bharadwaj Reddy Andapally
Technical Market Development Specialist and Technical Advisor for Nanocrystalline Soft Magnetic Materials, CBMM
Samir Ajlaoui
Research and Developing Engineer (R&D), TDK Electronics AG
Dragan Zuber
Senior Sales and Business Developer, Academia, TyphoonHIL
info[at]ecce-europe[dot]org (forwards to PCO)
papers[at]ecce-europe[dot]org (forwards to PCO)
sponsor-exhibition[at]ecce-europe[dot]org (Thomas Harder)
ECCE Europe 2026 is organized by
in cooperation with Local Organization (PCO)
Kenzler Conference Management (KCM)
Karla-Schmidt-Str. 14
30655 Hannover, Germany
Tel: +49 (0)511 65581860
E‐Mail: info[at]ecce-europe[dot]org
Website: https://kcmweb.de
Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0